Operating on Allegro AI Studio, AuraStack AI Super Agent helps shorten product launch time by 2 times, increase productivity by 15 times and improve quality based on multi-physical analysis in the industry's only Agentic AI silicon-to-system ecosystem.
Cadence (Nasdaq: CDNS) has just announced AuraStackTM AI Super Agent on Cadence® Allegro® AI Studio, the world's first Agentic AI platform for advanced printed circuit board (PCB) and packaging design, bringing designers from system planning to complete products in a single AI-native environment.
The next era of AI infrastructure spanning from data centers, automobiles, aerospace to physical AI will not only be shaped by silicon, but also by connection systems, power supply and cooling for silicon." - Michael Jackson, Vice President of Research and Development for Systems Design and Analysis at Cadence said.
Built on the same architecture as Cadence's ChipStack AI Super Agent, Agentic AI is combined with simulation and optimization tools based on principles, while taking advantage of the design intention perception model to automate and coordinate the discovery, realization and design process.
AuraStack AI Super Agent integrates automation and optimization capabilities for system planning, binding management, physical structure identification, IP creation and reuse, layout and routing, production-oriented design, as well as multi-physics analysis throughout Cadence's system design and analysis solution portfolio.
NVIDIA is using Cadence's solutions to support automation and optimization of increasingly complex system design processes for its engineering teams. “The scale and complexity of modern AI infrastructure requires a new design method.” - Tim Costa, Vice President and CEO of Computing Engineering at NVIDIA, said.
In addition, Cadence is partnering with TSMC to help customers accelerate the deployment of advanced packaging through AI-based automation, thereby ensuring timely convergence design for increasingly complex multi-systems. “As the complexity of advanced packaging increases, customers need new levels of automation to achieve timely design convergence.
Our long-term partnership with partners in the Open Innovation Platform® (OIP) ecosystem such as Cadence to provide advanced packaging design and verification solutions for TSMC 3DFabric® technology is helping customers accelerate the realization of new multi-generation dyeing systems for AI and high-performance computing. Through a multi-year collaboration on substrate automation, we have helped customers increase productivity 100 times while maintaining the quality of results equivalent to manual routing." - Aveek Sarkar, Director of Ecosystem and Alliance Management at TSMC said.
AI agents will change the packaging design of ICs and PCBs through the automation of SI, PI and heat processes, while allowing generative design. ” - Iwasaki Toshifumi, head of the leading design implementation unit of Global Leading Group at Socionext Inc. said.
“Close cooperation with Cadence has fundamentally changed the way FORVIA HELLA develops advanced automotive electronic systems. Thanks to AI-assisted deployment technology, a previous task of deploying 300 components that took up to four days can now be completed in just 4 minutes.” - Sven Hoenecke, Chairman and CEO of Electronics NSA at FORVIA HELLA shared.
For more information: http://www. cadence. com/go/aurastack.
