The Laborator Project for the manufacture of advanced packaging technology for advanced packaging microchips (Advanced Packaging) with a total capital of VND1,800 billion, invested by VSAP LAB Joint Stock Company.
The project implementation location is at the construction site at Software Park No. 2, Thuan Phuoc Ward, Hai Chau District, Da Nang City.
The scale of the project includes a land area of 2,298 m2; the products and services provided include advanced packaging and testing in the semiconductor field. The designed capacity is up to 10 million products/year.
The implementation progress is registered in many stages: completing legal procedures from the second to third quarters of 2025; starting construction in the fourth quarter of 2025; construction from the fourth quarter of 2025 to the second quarter of 2026; and putting into operation in the third and fourth quarters of 2026.
The project aims to concretize the practical and important requirements of Resolution No. 57 of the Politburo on breakthroughs in the development of science, technology, innovation and national digital transformation and Decision No. 1018 of the Prime Minister promulgating the Strategy for the development of Vietnam's semiconductor industry to 2030 and vision to 2050.
Scientific research and technological development in the field of science and technology and semiconductor technology and artificial intelligence; research and develop high -tech electrical and electronic products; Technical examination and analysis: Perform product inspection and testing activities; Providing technical services related to business activities such as installation, maintenance, consultancy, training and technical solutions for the product.
