On May 11, the Da Nang Department of Finance announced that it had invited investors to participate in the Laborator project serving the production of advanced packaging technology for semiconductor microchips in Da Nang, with a total investment of VND1,800 billion. The project is proposed by VSAP LAB Joint Stock Company, expected to be built on an area of 2,298m2 at Software Park No. 2 (Thuan Phuoc Ward, Hai Chau District).
The project focuses on advanced packaging technology for semiconductor microchips, meeting the Politburo's Resolution No. 57 on scientific and technological development and Decision No. 1018 of the Prime Minister on the strategy of developing Vietnam's semiconductor industry until 2030, with a vision to 2050. At the same time, the project is in the project of developing semi -conductor and artificial intelligence of the city.
The laboratory will conduct research and development of technology in the field of semiconductor microchips and artificial intelligence, including research and development of high-tech electrical and electronic products. The project also provides inspection, product testing, installation, maintenance, consultation, training and technical solutions. With a capacity of 10 million products/year, the project hopes to promote production and provide high-tech services in the semiconductor sector.
The project is designed with 4 floors and a roof railing, with a total floor area of about 5,685 m2, with a synchronous technical infrastructure, including electricity, water, fire protection, communication, air conditioning, environmental control. The laboratory will be equipped with modern equipment such as wafer bonding, wire bonding, FOWLP, optical scanning, electrical plating, standard packaging, measurement and analysis (X-ray, SEM), and automatic testing (ATE).
The project has an operating period of 50 years, expected to be implemented from the second quarter of 2025 to the fourth quarter of 2026. Registration documents are received from May 10 to May 24.
