Apple may apply new cooling technology on iPhone

TRÍ MINH (THEO PHONEARENA) |

Apple is said to apply vapor chamber cooling technology to the iPhone 17 to improve temperature control.

Keeping your smartphone's internal temperature under control is important. An overheating phone can cause the processor to slow down, resulting in lag, lag, slowness, and even freezing. High temperatures can also shorten battery life by degrading components.

According to a new report, Apple will use vapor chamber cooling technology for the iPhone 17 series, including both the Pro and regular versions, similar to what some other phone companies have done.

Currently, iPhones use a heatsink made of highly conductive metal to transfer heat away from the processor.

Meanwhile, vapor chamber technology works by sealing a liquid in a sealed chamber. When heated, the liquid turns into vapor, moves through the chamber, and dissipates the heat. When the vapor condenses, it returns to its liquid state and the process continues.

Vapor chambers are more efficient than traditional heatsinks, as they can move heat farther away from the processor to other areas inside the phone where it won’t be affected. They also take up very little space and don’t require fans or other cooling devices. They also help reduce the heat generated by charging your iPhone.

In fact, many iPhone 15 Pro Max users have experienced the device heating up when performing heavy tasks, such as when using Apple's smart features.

Vapor chamber technology will help keep the area around the processor cool, which is essential as iPhones become more and more packed with advanced features. This may be why Apple decided to include this technology in all iPhone 17 models.

Last August, analyst Ming-Chi Kuo, a reputable source for Apple information, predicted that the iPhone 17 Pro Max would be the first to use a vapor chamber because of its large size.

However, Apple seems to be expanding this technology to the entire iPhone 17 series. With the chips on the iPhone getting more and more powerful, Apple must have thoroughly tested these new cooling solutions before officially applying them.

TRÍ MINH (THEO PHONEARENA)
RELATED NEWS

Apple looks to improve notification summary feature

|

Apple is looking to improve Apple Intelligence's notification summary feature due to multiple bugs.

Apple falls behind Huawei, Vivo in China in 2024

|

iPhone shipments in China fell 25% in the fourth quarter of 2024, leaving Apple behind Huawei.

Apple participates in developing next-generation AI technology

|

Apple joined the Ultra Accelerator Link Alliance to develop the UALink standard, aiming to accelerate chip connectivity in the AI data center.

After the severe flood, Lam Dong farmers struggle to restore dragon fruit gardens

|

Lam Dong - After the floodwaters receded, many farmers began their journey to restore their dragon fruit gardens.

Foreigners can send dialogue questions to President Putin

|

Foreigners can also send questions to the year-end question-and-answer session with Russian President Vladimir Putin.

Vietnam sports delegation departs for the 33rd SEA Games

|

The Vietnamese sports delegation has officially departed for Thailand to participate in the 33rd SEA Games, with the goal of winning 90-110 gold medals.

Union Newsletter: Enterprises in Hanoi face difficulties in finding workers at the end of the year

|

The year-end labor market is bustling, businesses launch many policies to attract human resources, Social Insurance books become scams...

Apple looks to improve notification summary feature

TRÍ MINH (THEO appleinsider) |

Apple is looking to improve Apple Intelligence's notification summary feature due to multiple bugs.

Apple falls behind Huawei, Vivo in China in 2024

NGUYỄN ĐĂNG |

iPhone shipments in China fell 25% in the fourth quarter of 2024, leaving Apple behind Huawei.

Apple participates in developing next-generation AI technology

Văn Thắng (Theo TechCrunch) |

Apple joined the Ultra Accelerator Link Alliance to develop the UALink standard, aiming to accelerate chip connectivity in the AI data center.