According to sources shared by Huawei Central, Huawei - a major Chinese telecommunications company is nurturing a big target for its smartphone, with strong upgrades.
Accordingly, Huawei may launch a smartphone equipped with an HMB memory chip before Apple. If so, this will be a big challenge for the iPhone manufacturer in the AI (artificial intelligence) smartphone race.
HBM or high-bandwidth memory is a type of computer memory designed to transmit data at high speed and reduce power consumption.
With DRAM chips stacked on top of each other, this design helps increase signal transmission speed and memory bandwidth significantly, allowing processors (CPU and GPUs) to access and secure data from the storage much faster and more easily than traditional DRAM technology.
HMB is often found in high-performance graphics cards, it is an indispensable component in the operation of AI applications, including generative AI. HBM is considered an effective way to develop high-end AI smartphones.
Some other reports also say that Apple is considering integrating the HBM AI chip into the iPhone. Although the process will take several years. Therefore, the iPhone launched in 2027 could be the first Apple phone equipped with an HBM chip.
The iPhone maker may partner with two of the world's leading memory manufacturers, Samsung and SK Hynix, in the process, as HBM suppliers.
According to the latest leak, Huawei may be the first company to supply HBM chips to AI smartphones, instead of Apple. Huawei has partnered with many Chinese companies and even started developing HBM chips, as it cannot rely on foreign suppliers after the US export ban.
Initial reports say Huawei could develop the HBM chip by the end of 2026. Although neither Huawei nor Apple have confirmed the claims so far.
